Products & Solutions
Discover premium products from our trusted partners
Thermal Pads
Silicone and non-silicone thermal pads with 1.0~17.8 W/mK thermal conductivity range. Applied across servers, 5G, AI, automotive, and ESS industries. Shore 00-15~65 hardness for various gap-filling requirements.
Advanced TIM (Paste / Gel / PCM)
High-performance TIMs including thermal paste, conductive gel, phase change materials (PCM), and thermal putty. Various viscosities and conductivities for complex gap-filling and ultra-thin bondlines.
Thermal Tape & Graphite Sheet
Double-sided adhesive thermal tapes and high-conductivity graphite/graphene sheets. Lightweight with excellent heat spreading for smartphones, tablets, and slim electronics.
Heat Pipe & Vapor Chamber
Custom heat pipes (Ø3~12mm) and ultra-thin vapor chambers (0.4mm+). 50~100x higher heat transfer coefficient vs pure aluminum. High-performance cooling for servers, automotive, 5G, and medical.
Thermal Module & Heat Sink
M.2 SSD thermal modules, AlSiC heat spreaders, ceramic heat sinks, thermoelectric cooling chips (TEC), and more. Custom total solutions with thermal simulation analysis services.