Products & Solutions
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Waterjet Laser Cutting & Drilling System
CNC-controlled waterjet-guided laser hybrid processing system. Combines water jet and laser beam for ultra-precision cutting and drilling with absolutely zero thermal deformation or damage. Optimized for heat-sensitive, high-value materials in semiconductor, medical device, and aerospace applications.
DUV Precision Laser System
Femtosecond/Picosecond DUV (Deep UV) laser systems. Micron-level precision for micro-etching, cutting, and drilling of semiconductor wafers, thin films, polycarbonate, and composites. Cold processing with minimal thermal effects.
Wafer Laser Processing System
Laser systems dedicated to semiconductor wafer processing including silicon wafer dicing, grooving, and plasma vertical cutting. Low-stress, low-thermal processing preserving quality of high-density silicon wafers.
Special Laser Systems (3D Printing / Automation)
3D laser printing equipment and industrial automation precision laser systems. Advanced laser equipment from metal additive manufacturing to smart factory inline processing.
Optical Scales for Encoders
Precision optical scales manufactured with laser micro-etching technology. Produces drum, disc, and linear scales for encoders and actuators. Applied in robotics, CNC, and precision motion control equipment.
Laser Processing Services (OEM/ODM)
Contract precision laser processing services including micro-etching, cutting, drilling, and engraving. Custom processing solutions for semiconductor packaging, FPCB, optical components, biosensors, and optical communication parts.