Dry Vacuum Pumps

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Grand Hitek · 通嘉科技 — Official Korea Partner OHI Tech

Dry Vacuum Pumps

Grand Hitek (通嘉科技, Beijing Grand Hitek Co., Ltd.) is a vacuum equipment company founded in 2012 in Beijing, China. Focused on dry vacuum pumps and system integration, it combines R&D, production and service, and develops its full dry pump range and precision core parts in-house under its PPACS® product concept. Its products are widely used in semiconductor, solar PV, lithium battery, advanced display, LED and industrial vacuum applications, including wafer-level processes such as vacuum coating, etching and ion implantation. As Grand Hitek's official partner in Korea, OHI Tech helps you select the right model for your process and prepares quotations.

Official Korea PartnerInquire Now

Grand Hitek GLR · GMR · GHC · GS — Dry Vacuum Pumps

2012: Founded · Beijing, China
600+: Employees
60,000㎡+: Total factory area
220+: Authorized patents (since 2015)
30,000+: Units shipped (2024; 2,000+ for semiconductor)
15%: Semiconductor share, mainland China (2025)

Industries & Applications

Grand Hitek dry vacuum pumps serve not only semiconductor fabs but also display, solar PV, lithium battery, LED and industrial vacuum applications.

Semiconductor

15% share in mainland China (2025)

Processes

MOCVDPECVDLPCVDSACVDALDEtchHDPCoaterEPI

Recommended series

GLR: Load lock · transfer · PVD · coater
GMR: IMP source · strip/ashing · oxide/poly etch · metal etch (6/8-inch fabs) · HDP
GHC: ALD · PECVD · LPCVD · SACVD · MOCVD · metal etch
GHR: MOCVD · Si EPI · SiC EPI · HJT (high-flow H₂)

See «Recommended Series by Process» below for process challenges (condensation, corrosion, dust, thermal reaction, combustible gas).

Selection ↓

Display (FPD)

65%+ domestic share in China (2024)

Processes

PVDPECVDEtchLL/TCEvaporationLami bondingPHOTO

Recommended series

GHC: PECVD SiN · SiON · SiO₂ · metal etch · non-metal etch — condensation, corrosion, dust, combustible gas
GLR: PVD · LL/TC · evaporation · Lami bonding — frequent pumping
GLR-P: Coater PHOTO — condensation

Y2O3 coating, precision parts cleaning and seals for 6G/8.5G/10.5G display dry etch equipment are also available.

Solar PV

50%+ share in PV cells (2023)

Processes

Crystal pullingPECVDLPCVDALDLamination

Recommended series

GS-S: Crystal pulling — dust
GS: Cell PECVD · LPCVD — dust / cell ALD — pyrolysis, dust
GLR-P: Module lamination — condensation
GHR: HJT (high-flow H₂)

The GS series serves clean, general and harsh processes with high reliability and extremely low operating cost.

Lithium-ion Battery

Processes

Slurry mixingDegassingVacuum dryingStackingAssemblyElectrolyte fillingEOL testing

Recommended series

GLR: The full GLR range suits lithium battery production processes.
① Electrodes: Stirring* · coating · drying · rolling · cutting · vacuum drying* — resistant to dust, water vapor and solvents
② Cell assembly: Pairing · lamination · welding/packing/assembly* · electrolyte injection — resistant to dust and solvents
③ Finishing: Formation · degassing* · burn-in · EOL testing* — resistant to dust, water vapor and solvents

* Vacuum processes

LED & Other Industries

Recommended series

GLR: Used across FPD, LED and other markets
GHR: High-flow H₂ processes such as MOCVD — semiconductor, LED, solar PV
GTP molecular: Optical coating · vacuum furnaces · vacuum sintering · environmental simulation · scientific instruments (mass spectrometry, electron microscopes, leak detection) · ITO glass · LCD

Its products are also used in industrial vacuum applications.

Molecular pumps ↓

Dry Vacuum Pumps

Use the buttons below to see which series and processes apply to each industry.

5 series

GLR

110 – 4,500 m³/h

Multistage Roots dry pump for clean and general processes, with high reliability and extremely low operating cost.

Mechanism: Multistage Roots
Process duty: Clean · General
Models: GLR120 · GLR500 · GLR2000 · GLR3000 · GLR3500 · GLR5000
GLR-P: GLR-P series: GLR3000P · GLR5000 (3,380 – 4,500 m³/h)
Industries: Semiconductor · display · LED · lithium battery · solar PV

Recommended (semiconductor)

Load LockTransferPVDCoater

GMR

210 – 1,800 m³/h

Multistage Roots dry pump for clean and general processes, mainly used in semiconductor etch and ion implantation chambers. Low energy consumption, corrosion resistance and a small footprint.

Mechanism: Multistage Roots
Process duty: Clean · General
Models: GMR200 · GMR600 · GMR1200 · GMR1800
Industries: Semiconductor (etch · ion implantation)
Options: N: nickel alloy (corrosive processes)

Recommended (semiconductor)

IMP SourceStrip/AshingOxide EtchPoly EtchMetal EtchHDP

GHC

220 – 5,500 m³/h

New integrated claw dry pump for clean, general and harsh processes. Its strong dust handling makes it the first choice for harsh applications, at extremely low operating cost.

Mechanism: Integrated Claw
Process duty: Clean · General · Harsh
Models: GHC200 · GHC500 · GHC600 · GHC1200 · GHC1800 · GHC3000 · GHC5000 · GHC6000
Industries: Semiconductor · display
Options: T: high temp · Z: ultra-high temp · L: low temp

Recommended (semiconductor)

ALDPECVDLPCVDSACVDMOCVDMetal Etch

GS

1,800 – 5,500 m³/h

New integrated claw dry pump for clean, general and harsh processes, with high reliability and extremely low operating cost.

Mechanism: Integrated Claw
Process duty: Clean · General · Harsh
Models: GS1800 · GS1800H · GS2000E · GS2400E · GS3000 · GS3600E · GS4200S · GS5000 · GS6000
Industries: Solar PV and more

Recommended (semiconductor)

Solar PV processes and more

GHR

600 – 650 m³/h

Multistage Roots dry pump developed for high-flow hydrogen (H₂) applications in medium and harsh processes, with strong pumping capacity and high reliability.

Mechanism: Multistage Roots
Process duty: Medium · Harsh · H₂
Models: GHR600 · GHR700
Industries: Semiconductor · LED · solar PV

Recommended (semiconductor)

MOCVDSi EPISiC EPIHJT

Recommended Series by Process

Choose an industry to see the recommended series for each of its processes.

Semiconductor

Process	Series	Condensation	Corrosion	Dust	Thermal reaction	Combustible gas	High-flow H₂
Load Lock	GLR
Transfer	GLR
PVD	GLR
Coater	GLR	●
IMP Source	GMR	●
Strip/Ashing	GMR
Oxide Etch	GMR	●
Poly Etch	GMR		●
Metal Etch(6·8")	GMR	●	●
HDP	GMR		●
ALD	GHC	●	●	●	●	●
PECVD	GHC	●	●	●		●
LPCVD	GHC	●	●	●		●
SACVD	GHC	●		●	●	●
MOCVD	GHC	●			●	●
Metal Etch	GHC	●	●
MOCVD	GHR						●
Si EPI	GHR						●
SiC EPI	GHR						●
HJT	GHR						●

● = key challenge of the process · GMR is recommended for metal etch in 6- and 8-inch fabs.

Recommended Models for Semiconductor Etch-Type Processes

Process	By-products & challenges	Solution	Recommended
Oxide Etch	Light & medium polymers	Low risk	GMR600/1200
Poly Etch	Medium & harsh polymers, corrosive gases	Temperature control + nickel-alloy material	GMR600/1200 (N)
Metal Etch	AlCl₃ condensation	Medium temperature, anti-condensation	GMR600/1200/1800
HDP-CVD	Corrosion	Low temperature, corrosion resistance	GMR1200/1800 (N)
Strip/Ashing	Medium polymers	Medium temperature, anti-condensation	GMR1800
IMP	Medium polymers	Medium temperature, anti-condensation	GMR200

Display (FPD)

Process	Series	Condensation	Corrosion	Dust	Combustible gas	Frequent pumping
PECVD SiN	GHC	●	●		●
PECVD SiON	GHC	●	●	●	●
PECVD SiO₂	GHC		●	●	●
Metal Etch	GHC	●	●
Non-Metal Etch	GHC		●
PVD	GLR					●
LL/TC	GLR					●
Evaporation	GLR					●
Lami bonding	GLR					●
Coater PHOTO	GLR-P	●

● = key challenge of the process

Y2O3 coating, precision parts cleaning and seals for 6G/8.5G/10.5G display dry etch equipment are also available.

Solar PV

Process	Series	Condensation	Pyrolysis	Dust	High-flow H₂
Crystal pulling	GS-S			●
Cell PECVD	GS			●
Cell ALD	GS		●	●
Cell LPCVD	GS			●
Module lamination	GLR-P	●
HJT	GHR				●

● = key challenge of the process

The GS series serves clean, general and harsh processes with high reliability and extremely low operating cost.

Lithium-ion Battery

Process	Series	Dust	Water vapor	Solvents	Note
Slurry mixing*	GLR	●	●	●	① Electrodes
Vacuum drying*	GLR	●	●	●	① Electrodes
Stacking	GLR	●		●	② Cell assembly
Assembly*	GLR	●		●	② Cell assembly
Electrolyte filling	GLR	●		●	② Cell assembly
Degassing*	GLR	●	●	●	③ Finishing
EOL testing*	GLR	●	●	●	③ Finishing

● = key challenge of the process

* Vacuum processes

LED & Other Industries

Application	Series	Note
LED	GLR	FPD, LED and other markets
MOCVD (high-flow H₂)	GHR	Semiconductor, LED, solar PV
Etchers, metal deposition, Si epitaxy, PVD, CVD, SiC crystal growth	GTP-M	Magnetically levitated molecular pump
Solar manufacturing, ITO glass, LCD, environmental simulation	GTP-G1400 · G2400	Grease-lubricated, any mounting angle
Pan-semiconductor equipment, optical and hard coating	GTP-G800	Grease-lubricated molecular pump
Optical coating, vacuum furnaces, vacuum sintering, environmental simulation	GTP-L4400	Handles dust-laden gas
Scientific instruments, leak detectors, mass spectrometry, SEM	GTP-G300	Low vibration, low noise
Mass spectrometry, trace element analysis, electron microscopes	GTP-H80	Compact instrument pump
Leak detection, environmental monitoring, scientific analysis	GTP-H80D	Split-flow, multiple inlets

Its products are also used in industrial vacuum applications.

Integrated Vacuum Systems

Five integrated systems combining pumps, boosters, exhaust gas abatement and other equipment.

Grand Hitek Mizar integrated vacuum system

Mizar 开阳

Integrated stacked pump system with a mechanical booster – mechanical booster – dry pump structure, for clean, general and harsh processes, with high reliability and low operating cost.

Grand Hitek Megrez integrated vacuum system

Megrez 天权

Plasma integrated system for WN and heavy SiO₂ dust processes such as HARP and PE-TEOS. Combining the plasma generator and vacuum pump safely extends dry pump service life.

Grand Hitek Merak integrated vacuum system

Merak 天璇

Dual-deck multi-pump module that flexibly integrates vacuum pumps, chillers and more, with modules added or removed on demand. For semiconductor etch, PVD and other processes, it cuts hookup costs and facility points and shortens installation.

Grand Hitek Alioth integrated vacuum system

Alioth 玉衡

Multi-pump module integrating vacuum pumps and exhaust gas abatement to improve process safety and operating stability, reducing TCO, hookup costs, floor space and installation time.

Hookup cost 70%↓ · facility points 85%↓ · footprint 20%↓ · installation time 80%↓ · SEMI S2/S6/F47 certified

Grand Hitek Phecda integrated vacuum system

Phecda 天玑

Single-pump integrated module (dry pump + exhaust gas abatement) for diffusion, EPI, MOCVD and other processes: safe, reliable, stable, with predictive maintenance and a smaller footprint.

Molecular Pumps (GTP Series)

Pumping speeds shown are for N₂.

Magnetically levitated molecular pump GTP-M

N₂ 1,850 – 4,300 L/s

GTP-M2201 · GTP-M3400 · GTP-M4500

Contact-free, friction-free, lubrication-free and maintenance-free magnetic bearings with five-degree-of-freedom active control allow installation in any orientation. Used on etchers, metal deposition, silicon epitaxy, PVD, CVD and SiC crystal growth systems.

Grease-lubricated molecular pumps GTP-G · L

N₂ 300 – 4,200 L/s

GTP-G300 · G800 · G1400 · G2400 · GTP-L4400

Long-life, energy-saving molecular pumps (G series installable at any angle) for solar manufacturing, ITO glass, LCD panels, optical and hard coating, vacuum furnaces and scientific instruments.

Instrument molecular pumps GTP-H80 · H80D

N₂ 90 L/s

GTP-H80 · GTP-H80D

Compact high-vacuum pumps for mass spectrometers and other high-end instruments. The split-flow H80D has multiple inlets, doing the work of two to three pumps in leak detectors and similar applications.

Dedicated molecular pump power supplies (IGBT-based CNC) are also available.

Services & Parts

Please ask us about availability in Korea.

Vacuum pump overhaul (O&M)

Fault diagnosis, overhaul and remanufacturing, preventive maintenance and on-site service for dry vacuum pumps of major brands, with standardized processes, a defined warranty period and a spare parts warehouse to shorten downtime.

Y2O3 coating

Surface coating for semiconductor and display dry etch equipment parts. Etch and wear resistance extend part life and reduce replacement costs.

Precision parts cleaning

Precise control of surface particles and roughness for semiconductor parts, plus cleaning and O&M services for display PVD chamber parts.

Seals

FFKM seals for 6G/8.5G/10.5G dry etch equipment (APC valves, ICD, TEL, YAC) and VITON/FKM/FFKM seals for vacuum pumps.

Semiconductor Customer References

Repeat orders from major Chinese semiconductor customers, and collaboration with local equipment OEMs.

Customer	Process	Grand Hitek pumps	Best running time
SXX	Logic	400+	23,000h+
CXMT	DRAM	800+	17,000h+
HH Group	Logic	700+	12,000h+
YMTC	3D NAND	60+	12,000h+
HUAWEI	Logic + Memory + MEMS	800+	9,000h+
BYD	3GS + MEMS	500+	11,000h+

Some customer names are masked (e.g., SXX, S**C).

Semiconductor Install Base in China

Pump models by customer and module, with the longest running hours to date.

S**C

412 units

Module	Pump models	Max running (h)
CVD	GHC6000, GHC3000, GHC1800T	30,000+
CVD	GHC1800T	10,000+
ETCH	GHC1200	8,000+
ETCH	GMR1200	8,000+

C**T

836 units

Module	Pump models	Max running (h)
ETCH	GMR1200	12,000+
ETCH	GMR1200	11,000+
ETCH	GMR1200	9,000+
ETCH	GHC3000T	9,000+
CVD	GHC1200T, GHC3000T	17,000+

P*T

837 units

Module	Pump models	Max running (h)
Diff	GMR1200, GHC1800	5,000+
CVD	GMR1200, GHC1800, GLR120	7,000+
PVD	GMR1200, GHC1800, GMR600	9,000+
ETCH	GMR1200, GHC1800	8,000+

H* group

703 units

Module	Pump models	Max running (h)
ETCH	GMR1200	12,000+
ETCH	GMR1200	8,000+
CVD	GHC3000T	8,000+

BYD

564 units

Module	Pump models	Max running (h)
CVD	GMR600, GHC1800T	11,000+
PVD	GMR600, GHC1800T	9,000+
ETCH	GMR600, GMR1200, GHC1800T	10,000+
IMP	GMR1200	8,000+
LL	GLR120	10,000+

Nau**

304 units

Module	Pump models	Max running (h)
CVD	GHC600, GHC1200, GHC1800	9,000+
PVD	GHC600, GHC1200, GHC1800	7,000+
ETCH	GHC600, GHC1800	8,000+
IMP	GMR600, GMR1200	6,000+

8-inch fab

Module	Pump models	Max running (h)	Qty
CVD	GLR120, GHC1800T, GMR600, GHC1200T	9,000+	86
Etch	GLR120, GMR600, GHC1200	9,000+	42
IMP	GMR200, GMR1200	6,000+	18

Y**C

62 units

Module	Pump models	Max running (h)
WN ALD	GHC5000T	6,000+
PECVD	GHC3000T, GHC1800T	8,000+
PECVD	GHC3000, GHC1800T	12,000+
PECVD	GMR1200	8,000+

GMR Series Energy Savings

Up to 50% lower power than the compared series

Power consumption (kW)

600 class

GMR

0.8

iXM

1.1

SGM

1.6

1200 class

GMR

1.0

iXM

1.3

SGM

1.8

GMR600 vs SGM600A: −50% (−0.8 kW)
GMR1200 vs SGM1200A: −44% (−0.8 kW)

5-year utility cost (US$, converted at Oct 2026 rates)

600 class

GMR

US$7.81M

iXM

US$11.96M

SGM

US$15.61M

1200 class

GMR

US$11.28M

iXM

US$13.27M

SGM

US$22.04M

GMR600 vs SGM600A: −50% (≈ US$7.8 million)
GMR1200 vs SGM1200A: −49% (≈ US$10.5 million)

Assumptions: a 12-inch fab with 100,000-wafer capacity running 1,000 medium-duty pumps each of the 600 and 1200 class for five years; power + PCW + N₂ costs. Power US$0.150/kWh, N₂ US$0.037/m³, PCW US$0.075/m³.

Actual savings vary with process and operating conditions.

Product Features

Hardware and software designed for consistency and stability

Integrated stator-rotor design

Simple structure and easy assembly, with extremely high mechanical stability and straightforward temperature control.

Permanent magnet synchronous motor (PMSM)

More energy-efficient, lower-carbon and higher-torque than traditional motors, with no induced current.

Standard industrial-grade inverter

Wide compatibility and high operational stability.

Broad temperature control range

Handles complex process challenges.

Intelligent control system

HMI (human-machine interface) · CMS system · real-time parameters

Dry Pump Challenges in Semiconductor Fabs

Hardware costs

— CAPEX
— Footprint
— Hookup

Operational costs

— Unplanned downtime
— Wafer scrap
— Dust backflow
— Running cost

Safety incident costs

— Partial or full facility evacuation
— Safety incidents such as explosions

Key challengesUltimate equipment safety and reliabilityProcess application stabilityHigh product consistency

Solutions by Application Challenge

Challenge	Typical processes	Solutions
Condensation of residual process gases & by-products (gaseous)	Metal Etch; LPCVD Nitride; Coater	Increase pump temperature / heating jacket / increase N₂ flow
By-product (solid) deposition	PECVD Oxide; HARP; MOCVD	Maintain sufficient N₂ purge / powder trap / plasma trap
Pyrolysis of residual process gases & by-products (gaseous)	PEALD; WCVD	Reduce internal pump gas temperature / hot trap
Unreacted gases reacting inside the pump	WN; HARP	Add a divert pump / pre-remove one reactant gas / adjust recipe timing / reduce internal pump gas temperature
Corrosive gases reacting with the pump body to form FeF₃	HDP; Poly Etch	Lower pump body temperature / Ni alloy / anti-corrosion coating / increase N₂ flow (reduce corrosive gas concentration)

Different challenges require different dry pump mechanical designs.
Pump temperature control is a core factor.
Each application needs tailored nitrogen purge settings.

PPACS® Product Concept

Better performance · lower energy consumption · smaller footprint · lower cost · safer operation

Performance Enhanced

Stability · reliability · consistency

Power Optimized

Cut vacuum system energy consumption by 30–50% by 2030

Area Compacted

Cut vacuum system footprint by 30–50% by 2030

Cost Reduced

Cut the total cost of ownership (TCO) of vacuum systems by 30–50% by 2030

Safety Assured

Multi-level safety system protection, targeting zero safety incidents during vacuum system operation

How to Read Model Names

Application

H: Harsh / H₂
M: Medium
L: Light

Mechanism

C: Claw
R: Roots
S: Screw

Pumping speed class

120 · 200 · 500 m³/h
600 · 1,200 · 1,800 m³/h
3,000 · 4,500 · 6,000 · 7,000 m³/h

Temperature version

T: High temperature
Z: Ultra-high temperature
L: Low temperature
(blank): Standard

Anti-corrosion

N: Nickel alloy
C: Coating
(blank): SG iron

Example: GHC1800T = harsh duty · claw · 1,800 m³/h class · high-temperature version · SG iron

Semiconductor Model Catalog

Models by speed class, with equivalent models from other makers (reference).

Duty	Series	Mechanism	Speed class (m³/h)	Grand Hitek model	Edxx equivalent	Ebxx equivalent
Light	GLR	Multistage Roots	120	GLR120	IXL120N	EVS-20(P/N)
Light	GLR	Multistage Roots	600	GLR600	iXL600N	EVS-100(P/N)
Light	GLR	Multistage Roots	1,200	GLR1200	IXL1000N	EVS-200(P/N)
Medium	GMR	Multistage Roots	200	GMR200	IXM200	ESR20N
Medium	GMR	Multistage Roots	600	GMR600 / GMR600N	IXM600 / iXM600 XD	EV-X100N
Medium	GMR	Multistage Roots	1,200	GMR1200 / GMR1200N	IXM1200 / iXM1200 XD	EV-X200N
Medium	GMR	Multistage Roots	1,800	GMR1800 / GMR1800N	IXM1800 / iXM1800 XD	EV-X300N
Harsh	GHC	Integrated Claw	200	GHC200	IXH200	EV-M20N / EST25N
Harsh	GHC	Integrated Claw	500	GHC500	iXH500H	—
Harsh	GHC	Integrated Claw	600	GHC600T	IXH610	EV-M102N / EST100WN
Harsh	GHC	Integrated Claw	1,200	GHC1200 / GHC1200T	iXH1220H / iXH1220HTX	EV-M202N / EST200WN
Harsh	GHC	Integrated Claw	1,800	GHC1800L / GHC1800T	iXH1820 / iXH1820HTX	EV-M302N / EST300WN
Harsh	GHC	Integrated Claw	3,000	GHC3000T / GHC3000L	iXH3050HTX / iXH3050H SC	EV-M502N / EST500WN
Harsh	GHC	Integrated Claw	4,500	GHC5000T / GHC5000Z	IXH4550HT / iXH4550HTXS	EV-M802N / EST800WN
Harsh	GHC	Integrated Claw	6,000	GHC6000T / GHC6000L / GHC6000Z	IXH6050HT / iXH6050H SC / iXH6050HTXS	—
Harsh	GHC (pump set)	Integrated Claw	7,000	GHC3000T + GMB6000	iXH3050H + pXH6000	—
H₂	GHR	Multistage Roots	600	GHR600	iXH645H	ESA100WN

The 7,000 m³/h entry is a pump set combining the GHC3000T with a GMB6000 booster.

Certifications & Qualifications

SEMI

SEMI S2-0724SEMI S6-0618SEMI S8-0218SEMI F47-0706

North America & EU

ETLULCE

Management systems

ISO 9001:2015ISO 14001:2015ISO 45001:2018

Corporate qualifications & patents

National-level specialized and sophisticated 'Little Giant' enterprise — valid Jul 2024 – Jun 2027
High-tech enterprise — GR202311004449, Nov 2023
Beijing specialized and sophisticated SME — 2024ZJTX1752, Oct 2024 – Oct 2027
Beijing new technology & new product — XCP2023IC0015, vacuum pump GS1800-1800C, Dec 2023
Invention patents ZL 2023 1 0292694.X, ZL 2023 1 0338837.6 and more; 220+ authorized patents since 2015

About Grand Hitek

Beijing Grand Hitek Co., Ltd. (通嘉科技) — headquartered in Beijing E-Town, a supplier of dry vacuum pump equipment and system technical services for semiconductor, solar PV, advanced display, LED lighting, lithium battery and other industries

Milestones

2026
- Land secured to expand production in Beijing, Wuhan and Hangzhou
- Japanese and Singapore subsidiaries established
2025
- Semiconductor share in mainland China rose to 15%
- Integrated machines and GHR series launched
- Full semiconductor process coverage
- Series B+ financing completed
- First overseas market entry
2024
- GLR series developed and verified
- Cumulative shipments 30,000+ units (2,000+ for semiconductor)
- Domestic share in advanced displays exceeded 65%
2023
- GS, GMR and other series launched for solar PV and semiconductor processes
- Share in PV cells exceeded 50%
- Beijing Yizhuang base expanded, stable output of 2,000 units/month
2022
- GS series developed and verified
- New pump capacity reached 300 units/month
2021
- Series A financing completed
- Officially entered the semiconductor market
2020
- Small-batch verification passed
2019
- GHC series verified and shipped in small batches
- Parts recycling and pump service business accelerated in East China
2018
- Multiple software copyrights obtained
- DP control system developed
- GHC series client demos
2017
- GHC and MB series developed
- Entered display and semiconductor harsh process applications
2016
- Wuxi production base established
- Pump maintenance business expanded in Central China
- DP client process demos started
2015
- Key components developed; independent development began
2012
- Company founded; started trading and branded vacuum pump service

Production, R&D and Service Network

Four production bases, four R&D bases and seven O&M service centers across mainland China, Japan and Singapore, with more than 60,000㎡ of total factory area.

Location	Role	Status
Beijing (HQ, E-Town)	Management headquarters (new campus under construction) · R&D headquarters · sales platform · production of new pumps, scrubbers and chillers · pump overhaul	Operating
Langfang, Hebei	Production · parts cleaning	Operating
Minhang, Shanghai	All-in-one machine R&D and production · branded pump overhaul	Operating
Xi'an, Shaanxi	Molecular pump R&D and overhaul	Operating
Japan	Technology center (subsidiary established 2026)	Operating
Singapore	Pump overhaul and sales platform covering Singapore and Malaysia (subsidiary established 2026)	Operating
Hangzhou, Zhejiang	Production of new pumps	Under construction
Wuhan, Hubei	Pump overhaul and production	Under construction
Chengdu, Sichuan	Pump overhaul	Under construction

R&D Capabilities

R&D team

— 100+ R&D staff (16% of the workforce)
— 4 doctors and associate professors
— Deep industry background and development experience

Three R&D bases

— Beijing — dry pumps
— Shanghai — integrated machines
— Xi'an — molecular pumps

Technology platform

— Rational design based on vacuum principles
— Testing technology platform
— Simulation platform
— Pumping speed simulation

IPD integrated product development

— Innovation driven by market demand
— Clear product roadmap
— Stable product performance
— Shorter development cycles and faster launches

Four-in-one R&D chain

— Independent in-house R&D
— Joint research with universities
— Precision digital intelligent processing
— Professional testing and analysis

Frequently Asked Questions

Where can I buy Grand Hitek (通嘉科技) dry vacuum pumps in Korea?+

OHI Tech is the official Korean partner of Grand Hitek (Beijing Grand Hitek Co., Ltd.). OHI Tech handles model selection and quotation requests for its dry pumps, integrated vacuum systems and molecular pumps.

How do the dry pump series differ?+

GLR (including GLR-P) is a multistage Roots pump for clean and general processes (110–4,500 m³/h); GMR a multistage Roots pump for etch and ion implantation chambers (210–1,800 m³/h); GHC an integrated claw pump with strong dust handling for harsh processes (220–5,500 m³/h); GS a new integrated claw pump used in solar PV and other markets (1,800–5,500 m³/h); and GHR a multistage Roots pump for high-flow hydrogen (H₂) processes (600–650 m³/h). Figures in parentheses are maximum pumping speeds.

Which industries besides semiconductor use these pumps?+

They serve display (GHC for PECVD and etch, GLR for PVD, LL/TC, evaporation and Lami bonding, GLR-P for coater PHOTO), solar PV (GS-S for crystal pulling, GS for cell PECVD/LPCVD/ALD, GLR-P for module lamination), lithium batteries (the full GLR range for vacuum drying, degassing, assembly, EOL testing and more), LED and industrial vacuum. Grand Hitek's domestic share exceeds 65% in advanced displays (2024) and 50% in PV cells (2023).

Which series should I choose for each semiconductor process?+

GLR is recommended for load lock, transfer, PVD and coater; GMR for IMP source, strip/ashing, oxide/poly etch and HDP; GHC for ALD, PECVD, LPCVD, SACVD, MOCVD and metal etch; and GHR for high-flow H₂ processes such as MOCVD, Si EPI, SiC EPI and HJT. GMR is also recommended for metal etch in 6- and 8-inch fabs.

How do I read a model name such as GHC1800T?+

Under the naming rule, the first letter after G is the application (H: Harsh/H₂, M: Medium, L: Light), the second is the mechanism (C: Claw, R: Roots, S: Screw), and the number is the pumping speed class in m³/h. Trailing letters give the temperature version (T: high, Z: ultra-high, L: low, none: standard) and anti-corrosion material (N: nickel alloy, C: coating, none: SG iron). GHC1800T is a harsh-duty claw pump, 1,800 m³/h class, high-temperature version.

What certifications and qualifications does Grand Hitek hold?+

The pumps hold SEMI S2-0724, S6-0618, S8-0218 and F47-0706; ETL, UL and CE; and ISO 9001:2015, ISO 14001:2015 and ISO 45001:2018. The company is a national-level specialized and sophisticated 'Little Giant' enterprise and a certified high-tech enterprise, with 220+ authorized patents since 2015.

How much energy does the GMR series save?+

GMR600 draws 0.8 kW and GMR1200 1.0 kW — 50% and 44% (0.8 kW) less than the compared SGM600A and SGM1200A. Assuming 1,000 pumps each of the 600 and 1200 class running for five years, power, PCW and N₂ costs come out about 50% and 49% lower. Actual savings vary with process and operating conditions.

Are the pumps proven in production fabs?+

Grand Hitek has won repeat orders from major Chinese semiconductor customers — for example 800+ units at CXMT (DRAM), 700+ at HH Group (logic) and 500+ at BYD — with best running times of 9,000 to 23,000+ hours depending on the customer. Cumulative shipments passed 30,000 units in 2024 (2,000+ for semiconductor), and its semiconductor market share in mainland China reached 15% in 2025.

What products and services are offered beyond dry pumps?+

Five integrated vacuum systems (Mizar, Megrez, Merak, Alioth, Phecda), GTP molecular pumps (magnetically levitated GTP-M, grease-lubricated GTP-G/L and instrument GTP-H), plus vacuum pump overhaul, Y2O3 coating, precision parts cleaning and seals.

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