Products & Solutions
Discover premium products from our trusted partners
Laser Precision Equipment Specialist · OHI Tech Official Supply
Zero Heat. Maximum Precision.
Water-Guided Laser · Micro-Machining · Wafer Through-Process Total Solution
Product Portfolio
Full product lineup — from water-guided laser to optical encoders
Waterjet Laser Machine (LML)
Waterjet Laser Machine
Proprietary-patented Waterjet laser machine guides the laser beam via total internal reflection inside a water column — enabling HAZ-free cutting and drilling of 3rd-gen semiconductor materials (SiC, diamond, sapphire).
Specs / Model
Key Applications
Laser MicroJet (LML) Technology
Water guides the laser — HAZ zero, flawless precision machining
How It Works
High-Pressure Water Jet
A micro water column is formed at 50–800 bar pressure through a nozzle of Ø20–100 µm diameter.
Total Internal Reflection Laser Guiding
The 532 nm pulsed laser is fully guided inside the water column via total internal reflection (TIR) at the water-air boundary.
Simultaneous Cooling & Machining
Water guides the laser while cooling the workpiece surface in real time — HAZ is completely eliminated at the source.
Flawless Cut
Parallel kerf walls, zero burr, zero particle deposition. Working distance 5–50 mm, workpiece thickness 0.01–30 mm.
Zero HAZ
Water cooling eliminates heat-affected zones entirely — thermally sensitive materials like SiC and diamond processed without damage.
Parallel Kerf Walls
Near-perpendicular cut faces vs. conventional laser. High aspect ratio (>20 µm kerf width) achievable.
Zero Burr
Cutting is completed underwater — no metal burrs, fragments, or residual particles, ensuring clean cut surfaces.
Curved Cutting Patent
Unique patent (US 8,422,521 B2) synchronizes equal-energy pulses with motion — irregular curves cut precisely.
Conventional Laser vs. Laser MicroJet
| Parameter | Conventional Laser | Laser MicroJet (LML) |
|---|---|---|
| Heat-Affected Zone (HAZ) | Present | None |
| Kerf Angle | Tapered | Perpendicular (parallel walls) |
| Burr | Present | None |
| Residual Particles | Present | None (water-removed) |
| Working Distance | Short | 5–50 mm |
| Curved Cutting | Difficult | Patent-supported |
Wafer Through-Process — OHI Tech Dedicated Service
OHI Tech operates wafer through-hole drilling with customers using the HT-WG-LC machine. This high-precision through-process, difficult to find elsewhere, is performed directly in Korea.
TGV (Through-Glass Via)
Through-glass via drilling for optical glass IC wafers. Vertical through-holes achieved with zero thermal damage.
WBD (Wafer Based Drilling)
Through-hole machining of Si, SiC, GaN, and sapphire wafers. Meets high aspect ratio, small-diameter, parallel-wall requirements.
3rd-Gen Semiconductor Micro-Machining
SiC/GaN power device wafer micro-drilling and dicing. Zero chip damage vs. conventional diamond blades.
Process Collaboration
OHI Tech engineers directly analyze customer process requirements and collaborate with the manufacturer to derive optimal process conditions.
Industry Solutions
From semiconductors to wearables — real applications of laser precision technology
Semiconductor · Power Devices
Ultra-precise cutting and drilling of SiC/GaN power devices
About the Manufacturer
Est. 1995 · Hsinchu, Taiwan · Listed 7611
Founded in 1995 in Hsinchu Science Park, Taiwan, our manufacturing partner is a 30-year specialist in laser opto-mechatronics. Listed on the Taiwan Stock Exchange, it operates across three business divisions — laser micro-machining, optical encoder scales, and industrial laser marking — serving global customers from semiconductors to automotive.
Core Competency
Vertically integrating laser optics, precision mechanics, and motion control to develop customer-tailored laser machining solutions. Full support from design to mass production.
Patents
US 8,422,521 B2 / US 8,710,401 B2 — Equal-energy pulse and motion synchronization technology. World's only patent for water-guided laser cutting of curved and irregular shapes.
Certifications & Track Record
Why OHI Tech
OHI Tech is the official Korean distributor — one-stop support from equipment to process development and maintenance.
Korea's Only Wafer Through-Process
OHI Tech directly performs wafer through-hole drilling with customers using the HT-WG-LC machine.
Official Korea Distributor
Official sole distributor in Korea. One-stop support from equipment procurement to process optimization and after-sales.
LML Technology Consulting
Water-guided laser process fitness evaluation, sample testing, and process condition optimization.
Custom Equipment Config
3/4/5 axis, laser output, nozzle size — custom configurations tailored to your process requirements.
Laser Precision Machining & Wafer Through-Process Inquiry
Share your material and process specifications — we'll recommend the optimal equipment and process conditions.